Location History:
- Kaohsiung County, TW (2011)
- Kaohsiung, TW (2018)
Company Filing History:
Years Active: 2011-2018
Title: Innovations by Chao Cheng Liu in Semiconductor Technology
Introduction
Chao Cheng Liu is a notable inventor based in Kaohsiung County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative semiconductor packages that enhance the efficiency and reliability of electronic devices.
Latest Patents
Chao Cheng Liu's latest patents include advancements in semiconductor packaging. The first patent describes a semiconductor package that features a substrate with a conductive pad, a semiconductor device with a conductive member, and a connection element that links the two. This connection element is designed with a sidewall, where the angle relative to the conductive pad is equal to or less than about 90 degrees. The second patent outlines a semiconductor package and method for manufacturing it, which consists of a carrier, a chip, a stiffener, and an encapsulant. In this design, the chip is placed on the carrier, while the stiffener surrounds the chip, directly contacting the carrier and providing structural support. The encapsulant is used to seal both the chip and the stiffener, ensuring durability and protection.
Career Highlights
Chao Cheng Liu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in developing new technologies that improve the performance of semiconductor devices.
Collaborations
Chao Cheng Liu collaborates with talented colleagues, including Chia Chien Hu and Chien Cheng Liu. Their combined expertise contributes to the advancement of semiconductor technologies and the successful execution of innovative projects.
Conclusion
Chao Cheng Liu's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the industry. His advancements in semiconductor packaging are paving the way for more efficient electronic devices.