The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
May. 12, 2009
Chia Chien HU, Kaohsiung, TW;
Chao Cheng Liu, Kaohsiung County, TW;
Chien Liu, Kaohsiung County, TW;
Chih Ming Chung, Tainan County, TW;
Chia Chien Hu, Kaohsiung, TW;
Chao Cheng Liu, Kaohsiung County, TW;
Chien Liu, Kaohsiung County, TW;
Chih Ming Chung, Tainan County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier, and is mounted on the carrier. The encapsulant is adapted to seal the chip and the stiffener.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile