This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2004.
Company Filing History:
Years Active: 2004
Title: Chankeun Park: Innovator in Integrated Circuit Manufacturing
Introduction
Chankeun Park is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit manufacturing, particularly through his innovative patent.
Latest Patents
Chankeun Park holds a patent for a "Method for creating a damascene interconnect using a two-step electroplating process." This method addresses the challenges of forming void-free, low contact-resistance damascene interconnects during the manufacturing process of integrated circuits. The process involves a two-step copper (Cu) deposition, which includes a high-temperature rapid annealing after the first deposition. This technique allows for the effective filling of both narrow and deep openings as well as wide and shallow openings on the same substrate.
Career Highlights
Chankeun Park is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology in semiconductor manufacturing. His work has been instrumental in enhancing the efficiency and reliability of integrated circuits.
Collaborations
Chankeun has collaborated with talented coworkers such as Sangrok Hah and Juhyuck Chung, contributing to advancements in their field.
Conclusion
Chankeun Park's innovative approach to integrated circuit manufacturing exemplifies the impact of dedicated inventors in technology. His contributions continue to shape the future of semiconductor design and production.