Changyoung Yoo

Title: Changyoung Yoo: Innovator in Semiconductor Packaging

Introduction

Changyoung Yoo is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

Changyoung Yoo's latest patents focus on advanced semiconductor packages. One of his inventions includes a semiconductor package that features a circuit substrate with multiple interconnections. This package incorporates a first chip placed on the circuit substrate, with a second chip stacked on top of the first. It also includes a variety of first pads that overlap the first chip, along with bumps positioned between the circuit substrate and the first chip. Additionally, the design features second pads located on the edge of the circuit substrate, which are electrically connected to the second chip via conductive wires. An underfill material fills the space between the circuit substrate and the first chip, while a first dam, made of conductive material, overlaps at least one of the interconnections.

Career Highlights

Changyoung Yoo is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing efficient and reliable semiconductor packages that meet the demands of modern electronics.

Collaborations

Throughout his career, Changyoung has collaborated with notable colleagues, including Jongho Park and Kyungsuk Oh. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Changyoung Yoo's contributions to semiconductor packaging exemplify his dedication to innovation in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design, making him a valuable asset in the field.