Samsung Electronics Co., Ltd.

Changyoung Yoo

Jongho Park

Sangsoo Kim

Yongkwan Lee

Hyunki Kim

Kyungsuk Oh

Junyoung Oh

Seungkon Mok

A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

Semiconductor package

Growing community of inventors

Suwon-si, South Korea

Changyoung Yoo