Wuhan, China

Changxin Wan


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):

Title: Changxin Wan: Innovator in High-Temperature Self-Lubricating Materials

Introduction

Changxin Wan is a notable inventor based in Wuhan, China. He has made significant contributions to the field of materials science, particularly in the development of self-lubricating materials that can withstand high temperatures. His innovative approach addresses critical challenges in material performance and durability.

Latest Patents

Changxin Wan holds a patent for the "Preparation method of solid self-lubricating material with high temperature resistance." This invention outlines a method that involves mixing polymer matrix resin with nano lubricating filler to create uniform raw material powders. The process includes several steps, such as placing the powders in a hot-press die, maintaining specific temperatures, and controlling hot-pressing pressure to ensure optimal material properties. This method is designed to prevent degradation of tribological and mechanical properties during the compression molding process.

Career Highlights

Changxin Wan is affiliated with the Wuhan Research Institute of Materials Protection. His work focuses on enhancing the performance of materials used in various applications, particularly those requiring high-temperature resistance. His innovative methods have the potential to revolutionize the industry by providing more reliable and efficient materials.

Collaborations

Changxin Wan collaborates with esteemed colleagues, including Haitao Duan and Shengpeng Zhan. Their combined expertise contributes to advancing research and development in the field of materials protection.

Conclusion

Changxin Wan's contributions to the development of high-temperature self-lubricating materials highlight his role as an influential inventor in materials science. His innovative patent demonstrates a commitment to improving material performance and addressing industry challenges.

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