Taipei, Taiwan

Chang-Yu Hsieh



Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Taipei, TW (2017 - 2023)
  • New Taipei, TW (2021 - 2023)

Company Filing History:


Years Active: 2017-2023

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5 patents (USPTO):Explore Patents

Title: Chang-Yu Hsieh: Innovator in Heat Dissipation Technologies

Introduction

Chang-Yu Hsieh is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technologies, holding a total of 5 patents. His innovative designs focus on improving thermal management in various applications.

Latest Patents

One of his latest patents is a heat dissipation device designed to be in thermal contact with a heat source. This device features a heat dissipation body with at least one vertical channel and a cover plate that includes two layers with differing thermal conductivities. The design allows for efficient heat transfer, ensuring optimal performance. Another notable patent is a heat dissipation structure that accommodates a fluid and thermally contacts a heat source. This structure includes a heat conductive plate and a channel arrangement that forms a loop, enabling the fluid to absorb heat and change phase, thereby enhancing cooling efficiency.

Career Highlights

Chang-Yu Hsieh has worked with several notable companies, including Cooler Master Co., Ltd. and Asus Technology (Suzhou) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in thermal management.

Collaborations

Throughout his career, Chang-Yu has collaborated with talented individuals such as Shan-Yin Cheng and Hsiang-Fen Chou. These partnerships have fostered innovation and led to the development of advanced heat dissipation solutions.

Conclusion

Chang-Yu Hsieh is a distinguished inventor whose work in heat dissipation technologies has made a significant impact in the industry. His innovative patents and collaborations highlight his commitment to advancing thermal management solutions.

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