Chang-Shu Kuo

Title: Chang-Shu Kuo: Innovator in High-Power Module Fabrication

Introduction

Chang-Shu Kuo is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of materials science and engineering, particularly in the development of advanced fabrication methods for high-power modules. With a total of 4 patents to his name, Kuo's work is characterized by innovative approaches to enhancing the performance and stability of electronic components.

Latest Patents

One of Kuo's latest patents is a method of fabricating a high-power module. This method utilizes a non-touching needle to apply a slurry composed of nano-silver and micron silver particles onto a heat-dissipation substrate. The unique ratio of these silver particles, ranging from 9:1 to 1:1, allows for effective heat management. The process involves heating the substrate and placing an integrated chip (IC) above it, followed by thermocompression to create a thermal-interface-material (TIM) layer. This TIM layer boasts over 99 percent pure silver, ensuring no volatile organic compounds are generated during long-term use, while also maintaining stability under high temperatures.

Another significant patent by Kuo involves a light metal joining method and joint filler. This innovative joint filler is created by mixing a solvent with light metal powder and silver powder, where the light metal powder is on a micron scale and the silver powder is on a nanometer or submicron scale. The joining method includes coating the joint of two light metal pieces with the filler and applying hot pressing to bond the materials effectively.

Career Highlights

Throughout his career, Chang-Shu Kuo has worked with esteemed institutions such as National Cheng-Kung University and the Metal Industries Research & Development Centre. His research and development efforts have significantly advanced the understanding and application of materials in high-performance electronics.

Collaborations

Kuo has collaborated with notable colleagues, including In-Gann Chen and Hung-Tao Chen. Their combined expertise has contributed to the successful development of innovative technologies in the field.

Conclusion

Chang-Shu Kuo's contributions to the field of materials science and engineering are noteworthy. His innovative patents and collaborative efforts have paved the way for advancements in high-power module fabrication and light metal joining methods. His work continues to influence the industry and inspire future innovations.