The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Dec. 28, 2016
Applicant:
National Cheng Kung University, Tainan, TW;
Inventors:
Chang-Shu Kuo, Tainan, TW;
In-Gann Chen, Tainan, TW;
Hung-Tao Chen, Tainan, TW;
Han-Hsuan Cheng, Tainan, TW;
Assignee:
NATIONAL CHENG KUNG UNIVERSITY, Tainani, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01); B22F 1/02 (2006.01); B22F 1/00 (2006.01); H01J 37/32 (2006.01); C22B 11/02 (2006.01); B22F 9/22 (2006.01); C22B 15/00 (2006.01); C22B 5/02 (2006.01); D04H 1/541 (2012.01); D01D 5/11 (2006.01); B44C 1/22 (2006.01); D06M 11/01 (2006.01); D06M 11/34 (2006.01); C09K 13/00 (2006.01); B82Y 40/00 (2011.01); D04H 1/728 (2012.01); D01D 5/00 (2006.01); D06M 10/02 (2006.01);
U.S. Cl.
CPC ...
H01B 13/0036 (2013.01); B22F 1/004 (2013.01); B22F 1/0044 (2013.01); B22F 1/025 (2013.01); B22F 9/22 (2013.01); C22B 5/02 (2013.01); C22B 11/02 (2013.01); C22B 15/00 (2013.01); H01J 37/32009 (2013.01); B22F 2202/13 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); B22F 2998/10 (2013.01); B44C 1/227 (2013.01); B82Y 40/00 (2013.01); C09K 13/00 (2013.01); D01D 5/0007 (2013.01); D01D 5/11 (2013.01); D04H 1/541 (2013.01); D04H 1/728 (2013.01); D06M 10/02 (2013.01); D06M 11/01 (2013.01); D06M 11/34 (2013.01); H01J 2237/334 (2013.01); Y10T 442/109 (2015.04); Y10T 442/614 (2015.04); Y10T 442/655 (2015.04);
Abstract
A method of fabricating a conductive thin film includes the following steps: forming a polymer fiber made of a polymer and a metal precursor distributed in a surface layer near the surface of the polymer fiber; and applying a plasma treatment on the polymer fiber to concurrently etch the polymer and reduce the metal precursor in the surface layer of the polymer fiber. When the plasma treatment is completed, a metal membrane is formed on the surface of the polymer fiber.