This inventor holds 1 USPTO granted patent. Top assignee: National Chung Cheng University. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Chang-Ming Wang: Innovator in Thermosonic Wire Bonding Technology
Introduction
Chang-Ming Wang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wire bonding processes. His innovative approach has led to advancements that enhance the efficiency and quality of chip connections.
Latest Patents
Chang-Ming Wang holds a patent for a "Method of thermosonic wire bonding process for copper connection in a chip." This method involves controllable time, temperature, and humidity in an artificial environment, which generates a copper oxide film on the surface of a copper chip. The thickness of this film ranges from 8050 Å to 8200 Å. This invention provides a thermosonic wire bonding process that improves both efficiency and quality in semiconductor manufacturing.
Career Highlights
Chang-Ming Wang is affiliated with National Chung Cheng University, where he continues to engage in research and development in the field of semiconductor technology. His work has been instrumental in advancing the methodologies used in chip manufacturing.
Collaborations
Chang-Ming Wang collaborates with Yeau-Ren Jeng, contributing to the development of innovative solutions in their field.
Conclusion
Chang-Ming Wang's contributions to thermosonic wire bonding technology exemplify the impact of innovative thinking in semiconductor manufacturing. His work not only enhances the quality of chip connections but also sets a foundation for future advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile