The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Jan. 13, 2003
Applicants:
Yeau-ren Jeng, Tainan, TW;
Chang-ming Wang, Kaohsiung, TW;
Inventors:
Yeau-Ren Jeng, Tainan, TW;
Chang-Ming Wang, Kaohsiung, TW;
Assignee:
National Chung Cheng University, Chia-Yi, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K031/00 ;
U.S. Cl.
CPC ...
Abstract
A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200 Å. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.