Chang Jun Park

Title: Chang Jun Park: Innovator in Semiconductor Packaging

Introduction

Chang Jun Park is a notable inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on improving the efficiency and reliability of stacked chip package devices.

Latest Patents

Chang Jun Park's latest patents include a method for fabricating a stacked chip package device. This innovative stack package consists of at least two semiconductor chips arranged vertically. Bonding pads are strategically formed along a center line of the semiconductor chips. Inner leads from both a first and second lead frame are attached to the bonding pads of the respective chips. The inner leads are electrically connected to their corresponding bonding pads using metal wires. Additionally, the inner lead of the first lead frame is connected to the second lead frame through a conductive adhesive material. A connecting hole is incorporated at the outer end of the inner lead to enhance electrical connection during soldering. The entire structure is then molded with an epoxy compound, exposing the connecting parts between the lead frames and the outer lead of the second lead frame.

Another significant patent by Chang Jun Park is a chip stack package that utilizes a connecting hole to improve electrical connections between lead frames. This invention also features at least two semiconductor chips arranged vertically, with bonding pads formed along a center line. The inner leads of both lead frames are attached to the bonding pads, and the inner lead of the first lead frame is electrically connected to the second lead frame. The entire assembly is molded with an epoxy compound, ensuring that the connecting parts are exposed for optimal functionality.

Career Highlights

Chang Jun Park is currently employed at Hyundai Electronics Industries Co. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging, making significant strides in the industry.

Collaborations

Chang Jun Park has collaborated with notable coworkers, including Yoon Hwa Choi and Myung Geun Park. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.

Conclusion

Chang Jun Park is a distinguished inventor whose work in semiconductor packaging has led to multiple patents and advancements in the field. His contributions continue to shape the future of technology in this critical area.