Chang-Hsi Lin

Title: Chang-Hsi Lin: Innovator in Die Stacking Technology

Introduction

Chang-Hsi Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in die stacking technology. With a total of 3 patents to his name, Lin continues to push the boundaries of innovation in this critical area of technology.

Latest Patents

Chang-Hsi Lin's latest patents include a die stacking method and a die stacking apparatus. The die stacking method provides a comprehensive approach to executing a manufacturing recipe, which involves loading an interposer-die mapping file that corresponds to an interposer wafer. This method also includes loading combination setting data and a top die number, facilitating the precise placement of top dies onto interposer dies. The die stacking apparatus complements this method by incorporating a storage device for both top and interposer wafers, along with a carrier device and a transferring device to ensure accurate stacking of dies.

Career Highlights

Lin is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His work focuses on enhancing manufacturing processes and improving the efficiency of die stacking techniques. His innovative approaches have garnered attention and respect within the industry.

Collaborations

Throughout his career, Chang-Hsi Lin has collaborated with notable colleagues, including Chih-Chien Chang and Larry Jann. These partnerships have contributed to the advancement of technology in semiconductor manufacturing.

Conclusion

Chang-Hsi Lin is a key figure in the development of die stacking technology, with a proven track record of innovation and collaboration. His contributions continue to shape the future of semiconductor manufacturing.