Chang Eun Joo

Title: Chang Eun Joo: Innovator in Semiconductor Packaging

Introduction

Chang Eun Joo is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative designs and technical expertise.

Latest Patents

His latest patents include advancements in semiconductor packages. The first patent describes a semiconductor package that features a connection structure, a semiconductor chip, and a connection metal. This design incorporates a redistribution layer and a connection via layer, ensuring efficient electrical connections. The semiconductor chip is strategically placed on the connection structure, which includes a connection pad. The connection metal is also integrated into the structure, providing electrical connectivity through the connection pad. The second patent further elaborates on a semiconductor package that consists of a semiconductor chip with a body that has a first and second surface. This design includes a connection pad and an extension pad, along with a connection structure that features an insulating layer and a redistribution via. The innovative aspect of this patent is that the horizontal cross-sectional area of the extension pad is greater than that of the connection pad, enhancing the overall functionality of the semiconductor package.

Career Highlights

Chang Eun Joo is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing efficient and reliable semiconductor packages that meet the demands of modern electronics.

Collaborations

He collaborates with talented coworkers, including Sung Hoan Kim and Young Kyu Lim, who contribute to the innovative environment at Samsung Electronics.

Conclusion

Chang Eun Joo's contributions to semiconductor packaging reflect his dedication to innovation and excellence in technology. His patents not only enhance the functionality of semiconductor devices but also pave the way for future advancements in the field.