This inventor holds 2 USPTO granted patents. Top assignee: Hynix Semiconductor Inc.. Active years: 2010-2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010-2011
Title: Innovations by Chan Sun Lee
Introduction
Chan Sun Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents
One of his latest patents is titled "Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same." This invention presents a substrate for a semiconductor package that includes a substrate body, an insulation layer, and a reinforcing member designed to minimize distortions. The substrate body features a first region with multiple chip mount regions and a second region along the periphery, ensuring structural integrity through the inclusion of a reinforcing member.
Another notable patent is "Semiconductor package stack with through-via connection." This innovation involves a package stack comprising at least two packages stacked on one another. Each package contains a substrate, a circuit pattern, a semiconductor chip, and through-vias formed on the lateral surface. This design allows for efficient electrical connections between the packages, enhancing the overall functionality of the semiconductor stack.
Career Highlights
Chan Sun Lee is currently employed at Hynix Semiconductor Inc., a leading company in the semiconductor industry. His work at Hynix has positioned him as a key player in advancing semiconductor technologies.
Collaborations
Throughout his career, Chan has collaborated with notable colleagues, including Young Hy Jung and Jae Sung Oh. These collaborations have contributed to the development of innovative solutions in semiconductor packaging.
Conclusion
Chan Sun Lee's contributions to semiconductor technology through his patents and work at Hynix Semiconductor Inc. highlight his role as an influential inventor in the industry. His innovations continue to shape the future of semiconductor packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile