Chan Peng Yee

Title: Innovations by Chan Peng Yee in Semiconductor Manufacturing

Introduction

Chan Peng Yee is an accomplished inventor based in Malacca, Malaysia. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent that addresses common challenges in the industry. His work is recognized for its practical applications and potential to enhance manufacturing processes.

Latest Patents

Chan Peng Yee holds a patent titled "Die attach pad for use in semiconductor manufacturing and method of making same." This invention pertains to substrates used in semiconductor manufacturing. The design includes a peripheral ledge or similar structure in a die attach pad, which effectively retains adhesive that may flow from the die support surface when the die is attached. This innovative approach prevents adhesive from flowing off the die attach pad, thereby avoiding the creation of unwanted conductive areas on the outer surface of an integrated circuit package. Additionally, the reduction in the area of the die support surface and the retention of adhesive from any downbond areas help prevent delamination of the adhesive.

Career Highlights

Chan Peng Yee is currently employed at National Semiconductor Corporation, where he continues to develop and refine technologies that contribute to the semiconductor industry. His expertise and innovative mindset have positioned him as a valuable asset within the company.

Collaborations

Some of Chan's coworkers include Jaime A Bayan and Santhiran Nadarajah, who collaborate with him on various projects within the semiconductor field. Their teamwork fosters an environment of innovation and shared knowledge.

Conclusion

Chan Peng Yee's contributions to semiconductor manufacturing through his patent demonstrate his commitment to innovation and problem-solving in the industry. His work not only addresses existing challenges but also paves the way for future advancements in semiconductor technology.