The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Feb. 26, 2004
Jaime Bayan, Palo Alto, CA (US);
Santhiran Nadarajah, Melaka, MY;
Chan Peng Yee, Melaka, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Broadly speaking, the invention pertains to substrates for use in semiconductor manufacturing. A peripheral ledge or similar structure can be provided in a die attach pad, so as to retain adhesive that may flow from the die support surface when the die is attached to the die attach pad. In this manner, adhesive is prevented from flowing off the die attach pad, where it can create unwanted conductive areas on the outer surface of an IC package. The accompanying reduction in area of the die support surface, and retention of adhesive from any downbond areas, also prevents delamination of the adhesive.