Icheon-si, South Korea

Chae Sung Lee

USPTO Granted Patents = 4 

Average Co-Inventor Count = 2.0

ph-index = 1


Location History:

  • Icheon-si Gyeonggi-do, KR (2022)
  • Icheon-si, KR (2022 - 2023)

Company Filing History:


Years Active: 2022-2023

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4 patents (USPTO):Explore Patents

Title: Chae Sung Lee: Pioneering Innovations in Semiconductor Packaging

Introduction

Chae Sung Lee is a prominent inventor based in Icheon-si, South Korea, known for his significant contributions to the field of semiconductor packaging. With a remarkable portfolio of four patents, Lee has demonstrated an exceptional ability to innovate and enhance the manufacturing processes of semiconductor technologies.

Latest Patents

One of Lee's latest patents is titled "Stack packages and methods of manufacturing the same." This invention outlines a stack package that includes a first encapsulant layer formed on a carrier, with semiconductor dies sequentially offset stacked on this layer. It also details the formation of vertical connectors connected to these semiconductor dies, encapsulated by a second encapsulant layer. Furthermore, redistribution layers linked to the vertical connectors are established on the second encapsulant layer, showcasing a revolutionary approach to semiconductor packaging.

Another notable patent by Lee is "Semiconductor package including vertical interconnector." This invention covers a semiconductor package that features at least one semiconductor chip with its active surface facing a redistribution layer. The package includes vertical interconnectors extending vertically from chip pads to the redistribution layer, enhancing the connectivity and efficiency of semiconductor components. The design aspects, such as the molding layer that covers the semiconductor chip and vertical interconnectors, exhibit Lee’s commitment to advancing semiconductor technology.

Career Highlights

Chae Sung Lee works at SK Hynix Inc., a global leader in the semiconductor industry known for its innovative memory and non-memory solutions. His expertise and innovative spirit have made him a vital contributor to his organization and the broader tech landscape.

Collaborations

Throughout his career, Lee has collaborated with talented coworkers, including Ki Jun Sung and Tae Yong Lee. These partnerships have fostered a creative environment that has led to exceptional advancements in semiconductor packaging technologies.

Conclusion

Chae Sung Lee represents the forefront of innovation within the semiconductor industry. His patents not only reflect his ingenious mind but also contribute significantly to the evolution of semiconductor technology, paving the way for more efficient and advanced solutions in the electronic marketplace.

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