The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Feb. 15, 2021
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Chae Sung Lee, Icheon-si Gyeonggi-do, KR;
Jong Hoon Kim, Icheon-si Gyeonggi-do, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/02 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4889 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/3185 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16155 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A semiconductor package is described. The semiconductor packager includes a chip stack mounted over a package substrate, a first wire disposed over the package substrate, and a molding layer surrounding the chip stack and the first wire. The first wire has an acute angle.