Cha Soo Jeon

Title: The Innovations of Cha Soo Jeon

Introduction

Cha Soo Jeon is a notable inventor based in Daegu, South Korea. He has made significant contributions to the field of semiconductor technology. His work focuses on improving the performance and reliability of semiconductor devices.

Latest Patents

Cha Soo Jeon holds a patent for a semiconductor device and die bonding structure. This innovation addresses the formation of inter-metal compounds with semiconductor dies or lead frames. By doing so, it enhances electrical and mechanical properties, improves wettability, and suppresses the conglomeration of die bonding materials. The semiconductor device includes a semiconductor die, a barrier layer on its surface, a first metal layer on the barrier layer, a central metal layer on the first metal layer, and a second metal layer on the central metal layer. The first and second metal layers have a first melting temperature, while the central metal layer has a second melting temperature that is lower than the first.

Career Highlights

Cha Soo Jeon is currently employed at Kec Corporation, where he continues to innovate in semiconductor technology. His work has garnered attention for its practical applications in the industry.

Collaborations

Cha Soo Jeon collaborates with talented colleagues, including Kyu Hyo Hwang and Jong Hong Lee. Their combined expertise contributes to the advancement of semiconductor technologies.

Conclusion

Cha Soo Jeon's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patent reflects a commitment to enhancing device performance and reliability.