Newton, MA, United States of America

Cecily Andes

USPTO Granted Patents = 7 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Location History:

  • Watertown, MA (US) (2014 - 2015)
  • Marlborough, MA (US) (2016)
  • Newton, MA (US) (2015 - 2017)

Company Filing History:


Years Active: 2014-2025

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7 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Cecily Andes

Introduction

Cecily Andes is a prominent inventor based in Newton, MA, known for her significant contributions to the semiconductor manufacturing industry. With a total of seven patents to her name, she has developed innovative methods that enhance the efficiency and effectiveness of electronic device fabrication.

Latest Patents

Cecily's latest patents include advanced techniques in pattern formation methods and photolithographic methods. The pattern formation methods involve a series of steps that include providing a semiconductor substrate, forming a photoresist layer, and developing the exposed film with an organic solvent developer. These methods are particularly applicable in the semiconductor manufacturing industry. Similarly, her photolithographic methods outline a sequence of processes that also begin with a semiconductor substrate and culminate in the development of the exposed film. Both patents emphasize the use of specific compositions and materials that improve the performance of electronic devices.

Career Highlights

Cecily Andes has made a remarkable impact in her field through her innovative work at Rohm & Haas Electronic Materials LLC. Her expertise in semiconductor technology has positioned her as a key player in the development of cutting-edge electronic materials.

Collaborations

Cecily has collaborated with notable colleagues, including Jong Keun Park and Choong-Bong Lee, to further advance her research and innovations in the semiconductor industry.

Conclusion

Cecily Andes exemplifies the spirit of innovation in the field of semiconductor manufacturing. Her patents and collaborative efforts continue to shape the future of electronic device fabrication.

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