Chandler, AZ, United States of America

Casey Thielen

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Casey Thielen: Innovator in Electrical and Optical Interfaces

Introduction: Casey Thielen, an inventor based in Chandler, AZ, has made significant contributions to the field of electrical and optical interfaces. With one patent to his name, he demonstrates a unique ability to enhance bandwidth along the edges of packages, showcasing the intersection of innovation and technology.

Latest Patents: Casey holds a notable patent titled "Electrical and Optical Interfaces at Different Heights along an Edge of a Package to Increase Bandwidth along the Edge". This invention focuses on improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces. The design utilizes both optical and electrical fanouts on the same edge of a package, enabling higher performance and efficiency. Casey's inventive approach marks a pivotal advancement in the application of serialization techniques in modern electronic packages.

Career Highlights: Casey Thielen currently works at Intel Corporation, a leading name in technology and innovation. His role involves exploring advanced electrical and optical systems that enhance communication speed and efficiency in electronic packaging. The focus on bandwidth improvements reflects the fast-paced nature of today's technological landscape, positioning Casey as a key player in the ongoing development of innovative solutions.

Collaborations: Throughout his career, Casey has collaborated with talented professionals, including his coworker Ankireddy Nalamalpu. Together, they leverage their combined expertise to push the boundaries of what is possible in electrical and optical interface technology. Their collaborative efforts contribute to advancements that are vital for the future of electronics.

Conclusion: Casey Thielen stands out as a proactive inventor dedicated to enhancing the capabilities of electronic packaging through his innovative patent. As a member of the Intel Corporation team, he continues to drive progress in the arena of electrical and optical interfaces, paving the way for future advancements in technology. With ongoing collaborations and a focus on improving bandwidth, Casey's contributions will likely have a lasting impact on the field.

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