Cary J Baerlocher

This inventor holds 35 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Other. Active years: 2001-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cary J Baerlocher. Retrieved from https://idiyas.com/inventor/cary-j-baerlocher

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35

% Patents Active = 65.7

Average Co-Inventor Count = 2.8

ph-index = 11

Forward Citations = 395(Granted Patents)

Company Filing History:

34 out of 39,222

Micron Technology Incorporated

patents

1 out of 834,513

Other

patents

Years Active: 2001-2014

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Areas of Expertise:

Semiconductor Device

Molded Stiffener

Thin Substrates

Underfilled Die Assemblies

Integrated Circuit Package

Stackable Ball Grid Array

Electronic Devices

Circuit Encapsulation

Moisture-Resistant Package

Thermal Management

Microelectronic Devices

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8716849 - Semiconductor device including one or more stiffening elements (2014-05-06),

2. 8508034 - Electronic devices (2013-08-13),

3. 8148803 - Molded stiffener for thin substrates (2012-04-03),

4. 8115296 - Electronic device package (2012-02-14),

5. 8093730 - Underfilled semiconductor die assemblies and methods of forming the same (2012-01-10),

6. 7851907 - Semiconductor integrated circuit package having electrically disconnected solder balls for mounting (2010-12-14),

7. 7468559 - Semiconductor integrated circuit package having electrically disconnected solder balls for mounting (2008-12-23),

8. 7459773 - Stackable ball grid array (2008-12-02),

9. 7423331 - Molded stiffener for thin substrates (2008-09-09),

10. 7344921 - Integrated circuit device having reduced bow and method for making same (2008-03-18),

11. 7342319 - Semiconductor integrated circuit package having electrically disconnected solder balls for mounting (2008-03-11),

12. 7288431 - Molded stiffener for thin substrates (2007-10-30),

13. 7276802 - Semiconductor integrated circuit package having electrically disconnected solder balls for mounting (2007-10-02),

14. 7268067 - Semiconductor integrated circuit package having electrically disconnected solder balls for mounting (2007-09-11),

15. 7262074 - Methods of fabricating underfilled, encapsulated semiconductor die assemblies (2007-08-28),

Title: The Innovative Journey of Cary J Baerlocher

Introduction: Cary J Baerlocher, a talented inventor hailing from Meridian, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication.

Latest Patents: Cary J Baerlocher's latest patents showcase his commitment to pushing the boundaries of technology and problem-solving. His recent inventions have been recognized for their ingenuity and practicality.

Career Highlights: Throughout his illustrious career, Cary J Baerlocher has demonstrated a keen ability to identify gaps in the market and develop groundbreaking solutions. His innovative spirit has led to the creation of several successful products that have improved the lives of many.

Collaborations: Cary J Baerlocher's collaborative nature has allowed him to work with top industry experts and researchers, leading to the development of cutting-edge technologies. His partnerships have been instrumental in bringing his inventions to life and making a lasting impact on various fields.

Conclusion: Cary J Baerlocher's passion for innovation and relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire future generations to think outside the box and strive for greatness in the realm of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]