Carroll S Vance

Title: The Innovations of Carroll S. Vance

Introduction

Carroll S. Vance is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of integrated circuits, holding a total of 2 patents. His work has had a lasting impact on technology and innovation.

Latest Patents

Vance's latest patents include an "Integrated circuit with inter-chip link for boot-up." This integrated circuit features a first port for conducting a first plurality of signals and a second port for conducting a second plurality of signals. It includes a data path coupled between the two ports, a controller, and a processor with input and output capabilities. In a first mode, the controller allows the data path to conduct at least one signal received on the first port to the second port. In a second mode, the controller manages the processor to output signals to the second port. Another significant patent is the "Method of making three-dimensional integrated circuit interconnect module." This invention connects multiple chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each integrated circuit is mounted on a custom interconnect slice and tested, with the slices stacked together to create electrical connections from one layer to the next.

Career Highlights

Throughout his career, Carroll S. Vance has worked with prominent companies such as Microelectronics and Computer Technology Corporation and Silicon Laboratories Inc. His experience in these organizations has contributed to his expertise in integrated circuit technology.

Collaborations

Vance has collaborated with notable coworkers, including Claude Rathmell and David W. Barnes. Their combined efforts have further advanced the field of integrated circuits.

Conclusion

Carroll S. Vance's contributions to integrated circuit technology through his patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and inspire future innovations.