Silicon Laboratories Inc.

Microelectronics and Computer Technology Corporation

Carroll S Vance

Scott Thomas Haban

Younes Djadi

Seyed H Hashemi

Claude Rathmell

Wei Han

David W Barnes

An integrated circuit includes a first port for conducting a first plurality of signals, a second port for conducting a second plurality of signals, a data path coupled between the first port and the second port, a controller, and a processor having an input and an output. In a first mode, the controller causes the data path to conduct at least one signal received on the first port to the second port. In a second mode, the controller controls the processor to output signals to the second port.

Integrated circuit with inter-chip link for boot-up

A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical connections from one slice layer to the next. The module may use multi-layer ceramic slices or printed circuit board materials.

Method of making three dimensional integrated circuit interconnect module

Growing community of inventors

Austin, TX, United States of America

Carroll S Vance