Boston, MA, United States of America

Carlos Calvo

This inventor holds 1 USPTO granted patent. Top assignee: Metalenz, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Carlos Calvo. Retrieved from https://idiyas.com/inventor/carlos-calvo-hadjbxuv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Carlos Calvo: Inventor in Metasurface Technology.

Introduction

Carlos Calvo is an inventor based in Boston, Massachusetts, and is associated with Metalenz, Inc. His patent work concerns metasurface technology and methods for integrating optical components.

Latest Patents

Calvo is named on one patent: “Optical Module Including Metasurface Chip and Methods of Manufacturing Thereof.” The patent describes a metasurface module designed to reduce the cost of integrating metasurface elements into a housing. In one embodiment, a metasurface chip is mounted on a secondary substrate that extends beyond and surrounds the chip on all sides. The substrate can then be used to mount the chip within a housing, potentially allowing a smaller, less costly metasurface chip to be manufactured.

Career Highlights

Calvo’s disclosed patent work focuses on practical manufacturing and packaging approaches for metasurface-based optical modules. The invention addresses how a metasurface chip can be supported and integrated into a housing.

Collaborations

Calvo’s listed coworker is Ran Zhang. The patent is associated with Metalenz, Inc.

Conclusion

Carlos Calvo’s patent highlights an approach to metasurface module integration that may help reduce chip size and manufacturing costs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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