The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Dec. 30, 2022
Applicant:

Metalenz, Inc., Boston, MA (US);

Inventors:

John Graff, Swampscott, MA (US);

Carlos Calvo, Boston, MA (US);

Ran Zhang, Boston, MA (US);

Richard Norton, Boston, MA (US);

Assignee:

Metalenz, Inc., Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 7/02 (2021.01);
U.S. Cl.
CPC ...
G02B 7/02 (2013.01);
Abstract

Disclosed herein is metasurface modules configured to reduce the cost of integration of metasurface elements within a housing and methods of manufacturing thereof. One particular embodiment includes a metasurface module including: a secondary substrate; and a metasurface chip mounted on the secondary substrate. The secondary substrate laterally extends from all sides of the metasurface chip to completely surround the metasurface chip. The secondary substrate may be utilized to mount the metasurface chip within a housing which decreases the size of the metasurface chip and ultimately decreases manufacturing costs of the metasurface chip.


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