Carl J Raleigh

This inventor holds 11 USPTO granted patents. Top assignees: Motorola Corporation, Analog Devices,inc.. Active years: 1992-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Carl J Raleigh. Retrieved from https://idiyas.com/inventor/carl-j-raleigh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 90.9

Average Co-Inventor Count = 2.7

ph-index = 7

Forward Citations = 381(Granted Patents)

Location History:

Cary, IL (US) (1992 - 1993)
Reading, MA (US) (2014)
Phoenix, AZ (US) (1998 - 2016)

Company Filing History:

Years Active: 1992-2016

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9249010 - Electrical shielding in a MEMS leadframe package (2016-02-02),

2. 8692366 - Apparatus and method for microelectromechanical systems device packaging (2014-04-08),

3. 8624380 - Vertical mount package for MEMS sensors (2014-01-07),

4. 8174111 - Vertical mount package for MEMS sensors (2012-05-08),

5. 6300167 - Semiconductor device with flame sprayed heat spreading layer and method (2001-10-09),

6. 5751552 - Semiconductor device balancing thermal expansion coefficient mismatch (1998-05-12),

7. 5269453 - Low temperature method for forming solder bump interconnections to a (1993-12-14),

8. 5233504 - Noncollapsing multisolder interconnection (1993-08-03),

9. 5186383 - Method for forming solder bump interconnections to a solder-plated (1993-02-16),

10. 5154341 - Noncollapsing multisolder interconnection (1992-10-13),

11. 5086966 - Palladium-coated solder ball (1992-02-11),

Title: The Innovations of Carl J Raleigh

Introduction

Carl J Raleigh is a notable inventor based in Cary, IL (US), recognized for his contributions to the field of microelectromechanical systems (MEMS). With a total of 11 patents to his name, Raleigh has made significant advancements in electronic packaging technologies.

Latest Patents

One of his latest patents is focused on electrical shielding in a MEMS leadframe package. This innovation involves a lead frame packaged electronic chip that includes a MEMS device, an integrated circuit, and a wire bond that electrically couples the two components. The chip is encased in a molding material, and it features a mechanism that shields the wire bond and input/output pads from electromagnetic and radio frequency interference. Another significant patent is for an apparatus and method for MEMS device packaging. This patent describes a MEMS package that includes a substrate with an L-shaped cross-section, where a MEMS die is mounted in a way that optimizes its orientation relative to a PCB substrate.

Career Highlights

Throughout his career, Carl J Raleigh has worked with prominent companies such as Motorola Corporation and Analog Devices, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of electronics.

Collaborations

Raleigh has collaborated with several professionals in his field, including Cynthia M Melton and Steven Michael Scheifers. These collaborations have contributed to the development of his patents and innovations.

Conclusion

Carl J Raleigh's work in the field of MEMS and electronic packaging has led to significant advancements that enhance the performance and reliability of electronic devices. His contributions continue to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]