The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2001
Filed:
Dec. 12, 1994
Carl Raleigh, Phoenix, AZ (US);
William C. Roman, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device having a heat spreading layer (,) of material deposited by flame spraying on a back surface of the semiconductor die (,). The semiconductor die (,) has a thermal coefficient of expansion substantially similar to the thermal coefficient of expansion of the flame sprayed material. The flame sprayed material may be deposited directly on the semiconductor die (,) or on a backmetal layer (,). The heat spreading layer (,) is suitable for affixing the semiconductor die (,) to a metal substrate (,).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile