This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2001.
Company Filing History:
Years Active: 2001
Title: The Innovations of Carl E. Sklenicka
Introduction
Carl E. Sklenicka is a notable inventor based in Phoenix, AZ. He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance product durability and functionality. His work at Intel Corporation has positioned him as a key player in the development of advanced packaging solutions.
Latest Patents
Carl E. Sklenicka holds a patent for a "Mass Reflowable Windowed Package." This invention is designed to withstand the mass reflow process, where the entire package is subjected to solder reflow temperatures. In one embodiment of the patent, the lid features a ceramic frame and a glass window, providing both protection and visibility for the contents within.
Career Highlights
Throughout his career, Sklenicka has focused on improving packaging technologies that meet the demands of modern electronics. His work at Intel Corporation has allowed him to collaborate with some of the brightest minds in the industry, contributing to advancements that benefit a wide range of applications.
Collaborations
Some of his notable coworkers include Kabul S. Sengupta and Deborah L. Thompson. Their collaborative efforts have further enhanced the innovative capabilities within their team at Intel Corporation.
Conclusion
Carl E. Sklenicka's contributions to packaging technology exemplify the spirit of innovation that drives the industry forward. His patent for the mass reflowable windowed package showcases his commitment to developing solutions that meet the evolving needs of technology.