Cao Wei

Title: The Innovations of Inventor Cao Wei

Introduction

Cao Wei is a notable inventor based in Cupertino, CA. He has made significant contributions to the field of integrated circuit technology. His innovative work focuses on overcoming limitations in traditional semiconductor manufacturing processes.

Latest Patents

Cao Wei holds a patent for "Large sized silicon interposers overcoming the reticle area limitations." This invention involves a multi-die integrated circuit assembly that utilizes an interposer substrate larger than the typical reticle size. The design allows for the formation of through-silicon vias (TSVs) and interconnect conductors in a more efficient manner. By concentrating the external power, ground, and I/O signal line connections into a smaller area of each die, the configuration enables the mounting of multiple dies on the interposer. This innovation takes advantage of the active area for interconnections, allowing for a combined area of dies that is substantially greater than the active area of the interposer.

Career Highlights

Cao Wei is currently employed at Future Wei Technologies, Inc. His work at the company has positioned him as a key player in advancing semiconductor technologies. With a focus on innovative solutions, he continues to push the boundaries of what is possible in integrated circuit design.

Collaborations

Cao Wei collaborates with talented individuals such as Haoyu Song and Rui Niu. Their combined expertise contributes to the success of their projects and the advancement of technology at Future Wei Technologies.

Conclusion

Cao Wei's contributions to the field of integrated circuits exemplify the spirit of innovation. His patent on large-sized silicon interposers showcases his ability to address industry challenges effectively. Through his work, he continues to influence the future of semiconductor technology.