Future Wei Technologies, Inc.

Cao Wei

Anwar Mohammed

Haoyu Song

Rui Niu

A multi-die integrated circuit assembly includes an interposer substrate larger than the typical reticle size used in fabricating the 'active area' in which the through-silicon vias (TSVs) and interconnect conductors are formed in the interposer. At the same time, each of the dies has its external power/ground and I/O signal line connections concentrated into a smaller area of the die. The dies are disposed or mounted on the interposer such that these smaller areas (with the power/ground/IO connections) overlap with the active area of the interposer. In this configuration, a plurality of dies having a combined area substantially greater than the active area of the interposer can be mounted on the interposer (and take advantage of the active area for interconnections).

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Cupertino, CA, United States of America

Cao Wei