This inventor holds 1 USPTO granted patent. Top assignee: Kingpak Technology Inc.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: C H Chen and Image Sensor Packaging Innovation.
Introduction
C H Chen is an inventor associated with Hsinchu, Taiwan, and Kingpak Technology Inc. His work includes a patent for a package structure that connects an image-sensing chip to a flexible circuit board using flip-chip bonding.
Latest Patents
Chen’s listed patent is “Package Structure of an Image Sensor and Packaging.” The design places an image-sensing chip directly on a flexible circuit board, with corresponding bonding pads and signal input terminals electrically connected. Signal output terminals carry the resulting electrical signals to a printed circuit board, while a transparent layer covers the board’s upper surface and allows image signals to reach the sensor. The patent record lists 1 patent for Chen.
Career Highlights
Chen’s patent focuses on integrating image-sensor packaging with a flexible circuit board. The structure is designed to receive image signals through a transparent layer, convert them into electrical signals, and transmit them to a printed circuit board.
Collaborations
Chen is associated with Kingpak Technology Inc. His listed coworkers include Wen Chuan Chen and Kuo Feng Peng.
Conclusion
C H Chen’s listed invention addresses image-sensor packaging through direct flip-chip bonding and flexible-circuit integration.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile