Suwon, South Korea

Byungsoo Joo

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byungsoo Joo. Retrieved from https://idiyas.com/inventor/byungsoo-joo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Byungsoo Joo - Innovator in Wafer Cleaning Technology

Introduction

Byungsoo Joo is an inventor based in Suwon-si, South Korea. He is known for his innovative contributions to the field of wafer cleaning technology. Although he currently holds no granted patents, his work in this area is noteworthy.

Latest Patent Applications

Byungsoo Joo has submitted several patent applications that showcase his inventive ideas. One of his latest applications is for a "WAFER CLEANING DEVICE INCLUDING CHUCK TABLE." This device features a chuck stage designed to hold a wafer, with multiple ports for adsorbing the wafer and sucking liquid through the chuck stage. Additionally, it includes a pressure adjuster that provides vacuum pressure, allowing for selective communication with the exterior of the chuck stage.

Another significant application is for a "BUFFING CLEANING APPARATUS." This apparatus consists of a chuck table with a vacuum hole and a film on its upper surface. The film has a communication hole that aligns with the vacuum hole, enabling effective cleaning of the wafer placed on top. The design also incorporates a drain hole for liquid drainage, enhancing the cleaning process.

Conclusion

Byungsoo Joo's innovative patent applications reflect his commitment to advancing wafer cleaning technology. His contributions, although not yet patented, demonstrate a promising future in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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