Byung T Do

Title: Byung T Do: Innovator in Semiconductor Packaging

Introduction

Byung T Do is a notable inventor based in Inchang-Dong Guri, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance heat dissipation.

Latest Patents

Byung T Do holds a patent for a "Semiconductor package with integral heat dissipator." This highly integrated semiconductor package features a light and compact construction, along with effective heat dissipating means. The design includes a lower heat sink that dissipates heat generated from the semiconductor chip during operation. Additionally, the package incorporates a tape attached to the top of a plurality of inner leads, which are connected to the top surface of the lower heat sink. The heat dissipating means also includes a heat bar attached to the tape, with the possibility of integrating an upper heat sink to form a comprehensive heat dissipating solution.

Career Highlights

Throughout his career, Byung T Do has worked with prominent companies in the semiconductor industry. He has been associated with Anam Industrial Co., Ltd. and Amkor Electronics, Inc., where he has contributed his expertise in semiconductor packaging.

Collaborations

Byung T Do has collaborated with various professionals in his field, including his coworker Won Sun Shin. Their joint efforts have likely contributed to advancements in semiconductor technology.

Conclusion

Byung T Do's innovative work in semiconductor packaging has made a significant impact on the industry. His patent for a semiconductor package with an integral heat dissipator showcases his commitment to enhancing technology and efficiency in electronic devices.