The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 1997
Filed:
Dec. 12, 1995
Won S Shin, Seoul, KR;
Byung T Do, Inchang-Dong Guri, KR;
Anam Industrial Co., Ltd., Seoul, KR;
Amkor Electronics, Inc., Chandler, AZ (US);
Abstract
A highly integrated semiconductor package having a light and compact construction and heat dissipating means suitable to effectively dissipate heat generated from the package during the operation of the package is disclosed. The semiconductor package has a lower heat sink for dissipating heat generated from a semiconductor chip of the package. The package also has a tape attached to the top of a plurality of inner leads of the package. The inner leads are attached to the top surface of the lower heat sink. The package further has a heat dissipating means for dissipating heat generated from the inner leads. The heat dissipating means has a heat bar attached to the tape. An upper heat sink may be integrated with the heat bar so as to form the heat dissipating means.