Suwon-si, South Korea

Byung Sun Cha

This inventor holds 1 USPTO granted patent. Top assignees: Ajou University Industry-Academic Cooperation Foundation, Sungkyunkwan University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Byung Sun Cha. Retrieved from https://idiyas.com/inventor/byung-sun-cha

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Byung Sun Cha and Plasma Coating Innovation.

Introduction

Byung Sun Cha is an inventor based in Suwon-si, South Korea. His patent work includes a method for modifying the surface charge of nanovesicles using plasma technology.

Latest Patents

Cha is associated with 1 patent: “Plasma Coating Method of Nanovesicle Surface and Plasma Jet Device for Plasma Coating of Nanovesicle Surface.” The disclosed method uses plasma to change a nanovesicle’s surface charge from negative to neutral. It draws on the interaction between a neutral object and a negatively charged object, in which electron repulsion can cause the negatively charged object to become positively charged. The disclosure also describes a plasma jet device for carrying out the coating process.

Career Highlights

Cha’s listed affiliations include Sungkyunkwan University and Ajou University Industry-Academic Cooperation Foundation. His patent work reflects an application of plasma technology to nanovesicle surface modification.

Collaborations

His listed collaborators include Ana Sofia Pereira De Brito and Byeong Moon Kwak.

Conclusion

Byung Sun Cha’s patent centers on plasma-based nanovesicle coating, offering a method and device for controlling surface charge.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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