Byoung Chan Kim

Title: The Innovative Journey of Byoung Chan Kim

Introduction

Byoung Chan Kim is an accomplished inventor based in Suwon-si, South Korea. With a remarkable portfolio of nine patents, Kim has made significant contributions to the fields of semiconductor packaging and sensor technology. His innovative designs highlight the intersection of functionality and cutting-edge technology.

Latest Patents

Among Byoung Chan Kim's latest inventions are the fan-out sensor package and a fan-out semiconductor package. The fan-out sensor package features a core member that comprises a through-hole, housing an integrated circuit (IC) designed for sensor applications. This invention includes cleverly designed connection pads on both surfaces of the IC, enabling seamless electrical connections through through-silicon vias (TSVs). Furthermore, the encapsulant not only covers the core member but also fills portions of the through-hole, ensuring optimal functionality.

The fan-out semiconductor package is another showcase of Kim's ingenuity. It consists of a first connection member with a through-hole containing a semiconductor chip, encapsulated with an encapsulant. This design incorporates complex redistribution layers that effectively connect the chip’s connection pads, enhancing the semiconductor's performance while incorporating sensor patterns for fingerprint recognition in the second redistribution layers.

Career Highlights

Byoung Chan Kim has had an impressive career, working for notable companies in the electronics sector. He has contributed his talents to Samsung Electro-Mechanics Co., Ltd. and Samsung Electronics Co., Ltd., where he played a crucial role in developing innovative technological solutions. His expertise in semiconductor technology and product design has positioned him as a vital contributor to his teams.

Collaborations

Throughout his career, Byoung Chan Kim collaborated with talented professionals, including Yong Ho Baek and Jung Hyun Cho. These partnerships fostered an environment of creativity and innovation, allowing for the successful development of advanced technologies in the realm of semiconductor devices.

Conclusion

Byoung Chan Kim's contributions to the field of semiconductor packaging and sensor technology underscore his status as a leading inventor. His patented inventions, coupled with his impactful career at renowned companies, reflect a commitment to advancing technology and improving device functionality. As he continues to innovate, Kim is poised to influence the industry further, solidifying his legacy as a prominent figure in the world of inventions.