The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2012

Filed:

Nov. 10, 2010
Applicants:

Byoung Chan Kim, Cheongiu-si, KR;

Young Hwan Shin, Daejeon, KR;

Chin Kwan Kim, Daejeon, KR;

Dong Won Kim, Daejeon, KR;

Kui Won Kang, Cheongiu-si, KR;

Inventors:

Byoung Chan Kim, Cheongiu-si, KR;

Young Hwan Shin, Daejeon, KR;

Chin Kwan Kim, Daejeon, KR;

Dong Won Kim, Daejeon, KR;

Kui Won Kang, Cheongiu-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.


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