Company Filing History:
Years Active: 2012
Title: Innovations of Byeung Ho Kim in Semiconductor Technology
Introduction
Byeung Ho Kim is a notable inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approaches to manufacturing substrates for semiconductor packages.
Latest Patents
His latest patents include a method for manufacturing a substrate for a semiconductor package. This method involves several steps, such as attaching first and second insulation layers that have conductive layers on their surfaces. The process utilizes a release film with adhesives to ensure the insulation layers are properly aligned. Additionally, Byeung Ho Kim's patents detail the formation of conductive patterns and solder masks, culminating in the separation of the insulation layers by removing the release film. These innovations are crucial for enhancing the efficiency and reliability of semiconductor packages.
Career Highlights
Byeung Ho Kim is currently employed at Hynix Semiconductor Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing manufacturing techniques that improve the performance of electronic devices.
Collaborations
He collaborates with talented coworkers, including Young Berm Jung and Hong Bum Park, who contribute to the innovative environment at Hynix Semiconductor Inc. Their combined expertise fosters a culture of creativity and technological advancement.
Conclusion
Byeung Ho Kim's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work not only advances manufacturing processes but also enhances the overall performance of semiconductor packages.