The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
May. 26, 2009
Young Berm Jung, Chungcheongbuk-do, KR;
Hong Bum Park, Seoul, KR;
Young Geon Kwon, Chungcheongbuk-do, KR;
Seong Kwon Chin, Gyeonggi-do, KR;
Byeung Ho Kim, Chungcheongbuk-do, KR;
Seok Koo Jung, Gyeonggi-do, KR;
Young Berm Jung, Chungcheongbuk-do, KR;
Hong Bum Park, Seoul, KR;
Young Geon Kwon, Chungcheongbuk-do, KR;
Seong Kwon Chin, Gyeonggi-do, KR;
Byeung Ho Kim, Chungcheongbuk-do, KR;
Seok Koo Jung, Gyeonggi-do, KR;
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Abstract
A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.