Burn-Sik Jang

Title: Innovations by Burn-Sik Jang in Semiconductor Technology

Introduction

Burn-Sik Jang is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work is recognized for enhancing the efficiency and integration of semiconductor packages.

Latest Patents

One of Burn-Sik Jang's key patents is a semiconductor package and method for manufacturing it. This invention includes a first substrate with a pre-designed pattern, a first chip mounted using a flip chip method, and a first molding that covers both the substrate and the chip. The design features a first via that penetrates the molding and connects electrically with the substrate's pattern. Additionally, an interposer is placed on the first molding, with a second via that connects both sides of the interposer. The second substrate is positioned on the interposer, ensuring electrical connectivity through conductive balls. This innovative design aims to improve heat release and increase the degree of integration in semiconductor packages.

Career Highlights

Burn-Sik Jang is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the capabilities of semiconductor packaging.

Collaborations

Throughout his career, Burn-Sik Jang has collaborated with esteemed colleagues, including Do-Jae Yoo and Young-Do Kweon. These collaborations have contributed to the successful development of innovative semiconductor solutions.

Conclusion

Burn-Sik Jang's contributions to semiconductor technology, particularly through his patent for a semiconductor package, highlight his role as a leading inventor in the field. His work continues to influence advancements in semiconductor manufacturing and integration.