Dallas, TX, United States of America

Burhan Ozmat


Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 787(Granted Patents)


Location History:

  • Peekskill, NY (US) (1989)
  • Dallas, TX (US) (1989 - 2002)

Company Filing History:


Years Active: 1989-2002

where 'Filed Patents' based on already Granted Patents

9 patents (USPTO):

Title: Burhan Ozmat: Innovator in Integrated Circuit Packaging

Introduction

Burhan Ozmat is a notable inventor based in Dallas, TX, recognized for his contributions to the field of semiconductor packaging. With a total of 9 patents to his name, he has made significant advancements in integrated circuit technology.

Latest Patents

One of his latest patents focuses on a method of making semiconductor packages. This innovative approach involves providing a base with multiple cavities, forming sets of spaced apart apertures, and creating grooves that interconnect these apertures. The process allows for the separation of individual packages and includes the placement of electrical elements within the cavities. Additionally, the design incorporates features such as solder balls and cooling fins, enhancing the functionality of the semiconductor packages.

Career Highlights

Throughout his career, Burhan Ozmat has worked with prominent companies, including Texas Instruments Corporation and IBM. His experience in these leading organizations has contributed to his expertise in the field of integrated circuits and semiconductor technology.

Collaborations

Burhan has collaborated with notable coworkers, including Robert K Peterson and Scott L Jacobs, further enriching his professional journey and expanding his network within the industry.

Conclusion

Burhan Ozmat's innovative work in integrated circuit packaging has made a lasting impact on the semiconductor industry. His patents and collaborations reflect his dedication to advancing technology and improving electronic components.

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