Bud Troche

Title: The Innovative Contributions of Bud Troche

Introduction

Bud Troche is a notable inventor based in Gilbert, AZ (US), recognized for his significant contributions to the field of semiconductor technology. With a total of 5 patents to his name, Troche has made strides in developing advanced packaging solutions for microelectromechanical systems (MEMS).

Latest Patents

One of Troche's latest patents is the Reversible Top/Bottom MEMS Package. This innovative semiconductor device features a base substrate with multiple metal traces and base vias. An opening is formed through the base substrate, allowing at least one die to be attached to the first surface and positioned over the opening. The cover substrate, which also contains metal traces, forms a cavity that provides an RF shield around the die. This design enhances the performance and reliability of MEMS devices. Another patent under the same title outlines methods and systems for a reversible top/bottom MEMS package, emphasizing the integration of conductive plating and ground planes to ensure effective electrical coupling between the base and cover substrates.

Career Highlights

Bud Troche has built a successful career at Amkor Technology, Inc., where he has been instrumental in advancing semiconductor packaging technologies. His work has not only contributed to the company's reputation but has also pushed the boundaries of what is possible in the field of MEMS.

Collaborations

Throughout his career, Troche has collaborated with talented individuals such as David Bolognia and Bob Shih-Wei Kuo. These partnerships have fostered innovation and have led to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Bud Troche's innovative work in semiconductor technology, particularly in MEMS packaging, showcases his expertise and dedication to advancing the field. His contributions continue to influence the industry and inspire future innovations.