The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Jan. 11, 2012
Applicants:

David Bolognia, Scottsdale, AZ (US);

Bob Shih-wei Kuo, Chandler, AZ (US);

Bud Troche, Gilbert, AZ (US);

Inventors:

David Bolognia, Scottsdale, AZ (US);

Bob Shih-Wei Kuo, Chandler, AZ (US);

Bud Troche, Gilbert, AZ (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 23/552 (2006.01); B81B 7/00 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); B81B 7/0064 (2013.01); B81B 7/007 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/095 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/165 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19107 (2013.01); H01L 24/49 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.


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