Ingolstadt, Germany

Bruno Furbacher

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Matsushita Components Gmbh & Co Kg. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bruno Furbacher. Retrieved from https://idiyas.com/inventor/bruno-furbacher

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 107(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Bruno Furbacher: Innovator in Electronic Component Encapsulation

Bruno Furbacher is a notable inventor based in Ingolstadt, Germany. He has made significant contributions to the field of electronic components, particularly through his innovative patent.

Latest Patents

Furbacher holds a patent for an encapsulation for electronic components and a method for producing it. This encapsulation is specifically designed for Surface Acoustic Wave (SAW) components. The method involves using a cap to seal component structures on a substrate. The cap is designed as a cover on the substrate and features cutouts that accommodate the component structures in specific regions.

Career Highlights

Bruno Furbacher is associated with Siemens Matsushita Components GmbH & Co. KG, where he has been instrumental in advancing technologies related to electronic components. His work has led to the development of innovative solutions that enhance the reliability and performance of electronic devices.

Collaborations

Furbacher has collaborated with notable colleagues, including Friedrich Lupp and Wolfgang Pahl. Their combined expertise has contributed to the successful development of various projects within the company.

Conclusion

Bruno Furbacher's contributions to the field of electronic component encapsulation highlight his innovative spirit and dedication to advancing technology. His patent and work at Siemens Matsushita Components GmbH & Co. KG exemplify the impact of inventors in shaping the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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