The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Nov. 04, 1996
Applicant:
Inventors:
Bruno Furbacher, Ingolstadt, DE;
Friedrich Lupp, Munchen, DE;
Wolfgang Pahl, Munchen, DE;
Gunter Trausch, Munchen, DE;
Assignee:
Siemens Matsushita Components GmbH & Co. KG, Munich, DE;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
3103 / ; 310340 ;
Abstract
An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
Quick Actions:
Furbacher, Bruno. (1998). Encapsulation for electronic components and method for producing the (U.S. Patent No. 5831369). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5831369
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile