Bruce Simpson

Title: Bruce Simpson - Innovator in Processing Apparatus Technology

Introduction

Bruce Simpson is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of processing apparatus technology, holding a total of 2 patents. His work primarily focuses on improving the efficiency and effectiveness of wafer processing systems.

Latest Patents

Simpson's latest patents include innovative processing apparatuses designed for vacuum wafer transport systems. One of his patents describes a process module that allows wafers to be transported and processed in a face-down position under vacuum. This module features an additional wafer movement mechanism, enabling the susceptor to rotate from a horizontal to a nearly vertical position. This design allows for processing by a top process module, such as a sputter system or inspection module, while also accommodating a lower process module for simultaneous processing. Another patent outlines a method for sputter deposition compatible with vacuum processing systems, enhancing the capabilities of wafer processing by allowing for dry deglaze or cleanup steps.

Career Highlights

Bruce Simpson is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of semiconductor processing. His work has been instrumental in advancing the technology used in wafer processing, contributing to the efficiency and effectiveness of manufacturing processes.

Collaborations

Throughout his career, Simpson has collaborated with notable colleagues, including Cecil J. Davis and Joseph V. Abernathy. These collaborations have fostered a creative environment that has led to significant advancements in processing technology.

Conclusion

Bruce Simpson's contributions to processing apparatus technology have made a lasting impact on the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in wafer processing systems.