Bruce Euzent

Title: Bruce Euzent: Innovator in Semiconductor Packaging

Introduction

Bruce Euzent is a notable inventor based in Sunnyvale, CA, who has made significant contributions to the field of semiconductor packaging. With a total of 4 patents to his name, Euzent has focused on developing innovative solutions that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Euzent's latest patents is titled "Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate." This invention provides semiconductor die flip chip packages and components where specific properties are controlled to manage package stresses effectively. The fabrication methods outlined in this patent allow for the thickness of a die to be adjusted, minimizing the stress experienced by the die. This management of package stress is crucial for the incorporation of low-K Si dies and thin package substrates. Additionally, the patent describes how a thin die can be attached to a heat spreader, increasing rigidity for easier handling during the fabrication process.

Career Highlights

Bruce Euzent is currently employed at Altera Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging, making it more efficient and reliable.

Collaborations

Euzent has collaborated with notable colleagues such as Vadali Mahadev and Wen-chou Vincent Wang, contributing to various projects that enhance semiconductor technology.

Conclusion

In summary, Bruce Euzent is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. His innovative patents and collaborations reflect his commitment to improving technology in the semiconductor industry.