Tempe, AZ, United States of America

Brooks L Scofield, Jr

This inventor holds 2 USPTO granted patents. Top assignee: Motorola Corporation. Active years: 1992-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brooks L Scofield, Jr. Retrieved from https://idiyas.com/inventor/brooks-l-scofield-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 130(Granted Patents)


Company Filing History:


Years Active: 1992-1994

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2 patents (USPTO):Explore Patents

Title: Brooks L Scofield, Jr: Innovator in Semiconductor Technology

Introduction

Brooks L Scofield, Jr. is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for packaging and joining semiconductor devices, which are crucial for the advancement of electronic components.

Latest Patents

One of his latest patents is for a semiconductor wafer level package. This invention encapsulates a device fabricated on a semiconductor substrate wafer before the wafer is diced into individual chips. A cap wafer is bonded to the semiconductor substrate wafer using a pre-patterned frit glass as a bonding agent, ensuring that the device is hermetically sealed inside a cavity. A hole in the cap wafer allows for electrical connections to be made to the device through electrodes that pass through the frit glass seal.

Another significant patent involves a method of bump bonding and sealing an accelerometer chip onto an integrated circuit die. This method utilizes solder bumps to form a hybrid circuit assembly. The sensor die and integrated circuit die are manufactured separately and then joined by at least one solder bump. A dielectric sealant is deposited around the edges of the sensor to prevent foreign materials from interfering with its operation. The hybrid circuit assembly is then encapsulated in a plastic material.

Career Highlights

Brooks L Scofield, Jr. has had a distinguished career at Motorola Corporation, where he has applied his expertise in semiconductor technology. His innovative approaches have contributed to the development of advanced electronic devices, enhancing their performance and reliability.

Collaborations

Throughout his career, Scofield has collaborated with notable colleagues, including Victor J Adams and Paul T Bennett. These collaborations have fostered a creative environment that has led to groundbreaking advancements in semiconductor technology.

Conclusion

Brooks L Scofield, Jr. is a prominent figure in the semiconductor industry, recognized for his innovative patents and contributions to electronic device technology. His work continues to influence the field, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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